Global Underfill Market Segmentation and Competitor Analysis Report 2017

ReportsMonitor.com has added Global Underfill Market Research Report 2017 to its database of market research reports.
This report studies the Underfill market status and outlook of global and major regions, from angles of manufacturers, regions, product types and end industries; this report analyzes the top manufacturers in global and major regions, and splits the Underfill market by product type and applications/end industries.

The Global Underfill market size was 367.71 million USD in 2016 and it will be 454.71 million USD in 2022, with a CAGR 3.60% from 2016 to 2022.
The major players in global Underfill market include
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond

Figure Global Market Size (Million USD) Status and Outlook 2012-2022
Source: Annual Reports, Secondary Information, Press Releases, Expert Interviews and QYResearch, July 2017

Geographically, this report is segmented into several key Regions, with output/production, consumption, revenue, market share and growth rate of Underfill in these regions, from 2012 to 2022 (forecast), covering
North America
EU
China
Japan
South Korea
Taiwan
Other regions
Table Global Underfill Revenue (Million USD) Comparison by Regions (2012-2022)
Regions                2012       2016       2022       CAGR
(2016-2022)
North America  159.67   191.74   237.13   3.60%
EU          46           57.6        78.48     5.29%
China     19.68     23.27     29           3.74%
Japan    35.05     41.06     47.71     2.53%
South Korea       5.1          6.57        8              3.34%
Taiwan  5.74        6.4          7.95        3.68%
ROW      36.69     41.07     45.44     1.70%
Source: Annual Reports, Secondary Information, Press Releases, Expert Interviews and QYResearch, July 2017

On the basis of product, the Underfill market is primarily split into
Semiconductor Underfills
Board Level Underfills

Table Global Underfill Output/Production (K kg) and Growth Rate Market Split by Product Type
Market Segment by Type             2016       2017       2018       2019       2020       2021       2022
Semiconductor Underfills             168         182         195         208         222         235         249
-Change (%)       8.97%    8.41%    7.37%    6.56%    6.54%    6.14%    5.74%
Board Level Underfills    335         365         392         419         447         475         502
-Change (%)       8.43%    9.06%    7.40%    6.89%    6.59%    6.27%    5.77%
Total      502         547         587         627         668         710         751
-Change (%)       8.61%    8.84%    7.39%    6.78%    6.57%    6.23%    5.76%
Source: Secondary Literature, Press Releases, Expert Interviews and QYResearch, July 2017

On the basis on the end users/applications, this report covers
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
Table Global Underfill Consumption (K kg) by Application (2016-2022)
2012       2016       2022       Market Share (%)2022   CAGR
(2016-2022)
Industrial Electronics      109.4     153.5     235.8     31.42%  7.42%
Defense & Aerospace Electronics             20.3        30.4        47.8        6.37%    7.83%
Consumer Electronics    122         182.3     271.8     36.22%  6.88%
Automotive Electronics 28.9        40.4        59.1        7.87%    6.55%
Medical Electronics         49.9        67.3        94.3        12.56%  5.78%
Others  20.1        28.3        41.7        5.56%    6.67%

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